Letter
Designator

Package Type

DW

Plastic Wide Body (300 mil) S.O.I.C.
16-Pin SOIC (DW)
18-Pin SOIC (DW)
20-Pin SOIC (DW)
24-Pin SOIC (DW)
28-Pin SOIC (DW, DWP)

DP

Plastic Narrow Body Power S.O.I.C.
8-Pin SOIC (D, DP)
16-Pin SOIC (D, DP, DS)

DS

Plastic Narrow Body (150 mil) S.O.I.C. with Shunt Current Sense
16-Pin SOIC (D, DP, DS)

DWP

Plastic Wide Body Power S.O.I.C.
28-Pin SOIC (DW, DWP)

FP

Power Plastic Metric Quad Flatpack (MQFP)
64-Pin MQFP (FP)

FQ

Plastic Low Profile Quad Flatpack (LQFP)
48-Pin LQFP (FQ, FQP)

J

Ceramic Dual-in-Line (300 & 600 mil widths)
8-Pin Ceramic DIP (J)
14-Pin Ceramic DIP (J)
16-Pin Ceramic DIP (J)
18-Pin Ceramic DIP (J)
20-Pin Ceramic DIP (J)
24-Pin Ceramic DIP (J)
28-Pin Ceramic DIP (J)

L

Ceramic Leadless Chip Carrier (LCC)
20-Pin Ceramic Leadless (L)
28-Pin Ceramic Leadless (L)

LP

Power LCC
28-Pin Ceramic Leadless (LP)

M

Shrink Small Outline (150 mil)
16-Pin SSOP (M)
20-Pin SSOP (M)

MWP

Power Quasi Shrink Small Outline (300 mil body, 0.8mm Pitch)
36-Pin QSOP (MWP)
44-Pin QSOP (MWP)

N

Plastic Dual-in-Line (300 & 600 mil widths)
8-Pin Plastic DIP (N)
14-Pin Plastic DIP (N)
16-Pin Plastic DIP (N)
18-Pin Plastic DIP (N)
20-Pin Plastic DIP (N)
24-Pin Plastic DIP (N)
28-Pin Plastic DIP (N)

PW

Thin Shrink Small Outline (TSSOP)
8-Pin TSSOP (PW)
20-Pin TSSOP (PW)
24-Pin TSSOP (PW, PWP)

PWP

Power TSSOP
24-Pin TSSOP (PW, PWP)
28-Pin TSSOP (PWP)

Q

Plastic Leadless Chip Carrier (PLCC)
20-Pin Plastic PLCC (Q)
28-Pin Plastic PLCC (Q, QP)
44-Pin Plastic PLCC (Q, QP)

QP

Power PLCC
28-Pin Plastic PLCC (Q, QP)
44-Pin Plastic PLCC (Q, QP)

SP

Power Ceramic Dual-in-Line
16-Pin Sidebraze DIP (SP)
24-Pin Sidebraze DIP (SP

T

Plastic TO-220
3-Pin TO-220 Plastic (T)
5-Pin TO-220 Plastic (T)

TD

Plastic TO-263 Power Surface Mount
3-Pin Plastic TO-263 Power Surface Mount (TD)
5-Pin Plastic TO-263 Power Surface Mount (TD)

Z

Zig-Zag In-Line Power Package
16-Pin Zig-Zag Inline (Z)